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Changzhou Dayetengfei Sponge Factory  

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2016 HOT SALE Customize Shape Foam Packing Box of Electronic Chip 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: DY-A-008

2016 HOT SALE Customize Shape Foam Packing Box of Electronic Chip
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2016 HOT SALE Customize Shape Foam Packing Box of Electronic Chip

Quick Detail:

Product name  Foam packing box of electronic chip
Synonyms Foam packaging for electronic products
Usage electronic products  package
Item No. DY-A-008
Appearance Exquisite craft, precise size
Material Polyurethane, foam, etc.
Property  anti-static, high hardness, good elasticity.
Advantages Shock proof,wear seismic,anti-moisture and crash

 

Description:

Foam packing box of electronic chip

Cas no.:  DY-A-008

Appearance:  Exquisite craft, precise size.

Property:  Retardant, anti-static, high hardness, good elasticity.

Advantages:  Shock proof,wear seismic,anti-moisture and crash .

Applications:  Electrical equipment, electronic products, instruments packaging field.

 

 

Our advantages:

 

1. Factory direct sale

2. Strict quality control

3. Professional service

4. No matter the quality or price,we can either give you the best

5. OEM available

6. More than 10 lines for production to make sure the prompt leadtime

7. We have our own raw material factory,carton factory,packing material factory to control every link,and save you the cost from every link.

 

 

 

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 Mr. Ms. Kerry Fu

Tel: 86-519-86302896
Contact to this supplier

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Company Info

Changzhou Dayetengfei Sponge Factory [China (Mainland)]


Business Type:Manufacturer
City: Changzhou
Province/State: Jiangsu
Country/Region: China (Mainland)

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